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Shanghai Newlite Industrial Co. Ltd
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上海扭列特实业有限公司
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The ultrasonic scanning microscope UTC-W30 is used for internal defect detection of materials science, semiconductor industry, and other related products. Using an ultra-high-speed linear motor motion system to drive a high-frequency ultrasonic transducer, conducting water immersion C-scan inspections.
Full-wave array collection of ultrasonic signals is used to effectively identify internal defects in products through imaging algorithms and data image processing capabilities, resulting in clear internal images. It also statistically analyzes the location, shape, and size of defects, generating customized reports.
Product Features
Space-saving**: The integrated design reduces the amount of space the equipment occupies.
Portability**: The equipment is lighter and easier to move.
Simplified operation**: It reduces the complexity of user operation, offering a simpler and more intuitive user interface and operation process.
Low failure rate**: The high integration of the equipment means fewer internal connections compared to separate components, resulting in a lower failure rate and simpler maintenance and repair.
Nadcap certified**.
New vs. Old Product Comparison
Old Model
Separate design
Large footprint, not easy to move
Complex operation
Low integration, high maintenance costs
New Model
Integrated design
Smaller footprint, more portable
Simplified operation
High integration, lower failure rate, and reduced maintenance costs
Software Uniqueness
Detection Software**: Features include A-scan and C-scan displays, motion control interface, ultrasonic inspection parameter settings, interface tracking, region rescan, ABC triple gates, inspection path planning, and the ability to switch between scanning and stepping axes at will.
Analysis Software**: Capable of full waveform data collection, offline data reading, offline analysis of A-scan waveforms at any position, tomographic imaging at any position, and cross-sectional views from any angle (with customizable angle and cross-sectional length).
Defect Statistical Analysis**: Enables the localization, statistical measurement, and analysis of defect areas and sizes.